Coating oh plastic



GROSS COATING 0R PLASTIC Patented Mar. 6, 1934 UNITED STATES REFERENGEPATENT OFFICE GLUE George H. Osgood, Tacoma, Wash.

No Drawing. Application May 15, 1983, Serial No. 671,202

21 Claims,

My invention relates more particularly to glues comprising ve etableseed meal bases and consists in modifying the usual glue formula: byaddin thereto a small portion of an additive aldehyde compound which hasthe effect of pernnm reduction of the caustic soda and of increasing thelime and silicate of soda content.

f'l'i'e objects 0 my invention are to produce a glue which spreadsfurther, sticks better, and reduces the panel staining which wasformerly due to the large amount of caustic soda found to be necessaryheretofore.

- Vegetable seed residue glues produced from sowimseed, linseed, andlike see a emnmme time and have been successfully used, therefore noclaim to the glue base nor the other usual materials found therein, ismade. The materials usually contained in such glues arez-Seed-residueflour or meal; caustic soda; salts (Wm weal? acids, such as soda ash,trisodign; pugsmsodium fluoride; sodium silicate; lime; Ehdcarbon isup 1e.

A goo made, is as follows:-

Meal flour (soya bean, peanut or other seed residue meal) Water Causticsoda Lime Silicate of so a Trisodium phosphate Sodium chloride 2 Carbonbisulphide 2 This glue will spread approximately 2900 square feet ofthree-ply panels.

I have found by experiment that I can produce a glue using the gbpygmegtmnedsbases, and chemicals, that spreads further, thus using less glueper thousand square feet of panels, is improved in its adhesivequalities, and is of greater water resistance, by adding thereto a smallproportion of an additive aldehyde compound, thereby permitting the renotion of the caustic soda content therein and also permittingaffincrease in the lirne and thesi ligat epj sgda content.

The additive aldehyde compounds which may be used in my new glue includeformaldehyde bisoya bean or other Seed flour sulphite canon) (-o-somacetaldehyde bisulphite CHa-CHx'OH) (-OSOzNal benzaldehyde bisulphiteCsH5-CH(OH (-O-SOzNa) aldehyde ammonia (CHsCHOzNHa):

orm a or such a glue, as formerly Walter 15 lbs only nine-ten or otheradditive aldehyde compounds. However, I prefer to useformaldehrdannnlnhite be cause of its ease of manufacture but otheradditive aldehyde compounds are equally effective.

By the addition of two parts of the additivgal: dehyde compound I findthat I can cut the causjicjQQa, content down from eleven parts tofourand-a-half parts, and can increase the Lung content from three partsup to twenty parts and the gligate of sgda from twenty parts up tothirty parts and in this way I am able to lower the cost per pound ofthe glue and at the same time, and of still greater importance, the sameweight of glue base which formerly would spread only 2900 square feet ofthree-ply panel will now spread 3600 square feet thereof while stillretaining the same dry strength and water resistance; therefore, myimproved glue reduces the cost of the glue line per thousand square feetof three-ply panel about 40 cents or about 20% of the glue user'sordinary glue cost.

The formaldehyde bisulphite is preparedfrom the fa owing orm a:-

The f melmahisnlphite thus pre may be shipped either as a liquid,separate from the glue powder, 'Qrit maTBe evaporated to a crystal andadded to the dry glue mixture as a. 'dry powder but, in that-case, it isnecessary to "ship the glue powder in air-tight containers. When theliquid form of the formaldehyde bisulphite is used, two pounds thereofis used in a formula calling for 100 pounds of vegetable seed meal base,but if the dry form is used then hs of a pound of the powder is used forthe same quantity of the glue base. Though I have given the abovequantities of the additive aldehyde compound, I wish it to be understoodthat the amount may be varied from 0.5 to 5 pounds depending on theamount of water that it is desired to put in the glue.

The formula of one of my glues, varying somewhat from that of theordinary glue above quoted would be as follows:-

Parts Examiner Sodium acid sul hite 12 lbs. 15 oz. Pounds Formaldehyde 8lbs. 7 oz.

Heretofore from ten to twelve pounds of caustic soda was necessary tobring 100 pounds of 'the flour glue base to a suitable degree offluidity and ach'iesiveness, but this large amount of caustic sodacaused considerable trouble by staining the panel faces. A reduction ofthe quantity of caustic soda, as provided in my improved glue. is,therefore, greatly to be desired in the veneer panel industry. Also, themost lime that could be used without detracting frommrength of the gluehas been about seven pounds to a mixture with 100 pounds of the flourglue base, so that an increase in the quantity of lime and'of sodiumsilicate, as provided in my improved glue, is also highly desirablebecause of their cheapness, thus reducing the glue cost, wd because theynaturally increase the water resistance of the glue line.

The ingredients used may be of the easily obtainable commercial type;for example, ordinary city or tap water commercial sodiurmacicLsulphiteand the ordinary commercial 40% aqueous "solution of formaldehyde, whichsolution is known in the trade as formaldehyde.

I have referred to specific embodiments of my invention but have done somerely by way of illustration and not as a limitation of the inventionthe scope of which is defined in the appended claims.

Having described my invention, what I claim, and desire to secure byLetters Patent, is:

1. An adhesive composition comprising the reaction-product of avegetable seed residue meal or flour as its adhesive base, an aqueousalkaline medium and an additive aldehyde compound functioning to reducethe alkali requirement of the adhesive, the latter having increasedspreading properties as compared to an adhesive without the additivealdehyde compound.

2. An adhesive composition comprising the reaction-product of soya beanmeal or flour as its adhesive base, an aqueous alkaline medium and anadditive aldehyde compound functioning to reduce the alkali requirementof the adhesive, the latter having increased spreading properties ascompared to an adhesive without the additive aldehyde compound.

3. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base; an aqueous alkalinemedium, and an additive aldehyde bisulphite compound functioning toreduce the alkali requirement of the adhesive, the latter havingincreased spreading properties as compared to an adhesive without theadditive aldehyde bisulphite compound.

4. An adhesive composition comprising the reaction-product of 100 partsvegetable seed residue flour, 4 parts caustic soda, 30 parts silicate ofsoda, 20 parts of lime, 2 parts of carbon bisulphide, and 2 parts of aliquid additive aldehyde compound functioning to reduce the alkalirequirement of the adhesive, the latter having increased spreadingproperties as compared to an adhesive without the additive aldehydecompound.

5. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base an aqueous alkalinemedium, an alkali earth metal hydroxide, and an additive aldehydecompound functioning to reduce the alkali requirement of the adhesiveand increase the adaptiveness of the adhesive to said alkali metalhydroxide, said adhesive having increased spreading properties ascompared to a similar adhesive without the additive aldehyde compound.

6. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalinemedium, an alkali earth metal hydroxide, a soluble alkali metalsilicate, and an additive aldehyde compound functioning to reduce thealkali requirement of the adhesive and increase the adaptiveness of theadhesive to said alkali metal hydroxide, said adhesive having increasedspreading properties as compared to a similar adhesive without theadditive aldehyde compound.

7. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalinemedium, an alkali earth metal hydroxide, a soluble alkali metalsilicate, an alkali carbonate, an alkali phosphate, and an additivealdehyde compound functioning to reduce the alkali requirement of theadhesive and increase the adaptiveness of the adhesive to said alkalimetal hydroxide, said adhesive having increased spreading properties ascompared to a similar adhesive without the additive aldehyde compound.

8. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalinemedium, an alkaline earth metal hydroxide, a soluble alkali metalsilicate, sodium carbonate, trisodium phosphate, and an additivealdehyde compound functioning to reduce the alkali requirement of theadhesive and increase the adaptiveness of the adhesive to said alkalimetal hydroxide, said adhesive having increased spreading properties ascompared to a similar adhesive without the additive aldehyde compound.

9. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqeous alkalimedium, an alkali earth metal hydroxide, a soluble alkali metalsilicate, an alkali carbonate, an alkali phosphate, carbon bisulphide,and an additive aldehyde compound functioning to reduce the alkalirequirement of the adhesive and increase the adaptiveneess of theadhesive to said alkali metal hydroxide, said adhesive having increasedspreading properties as compared to a similar adhesive without theadditive aldehyde compound.

10. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalimedium, an alkali earth metal hydroxide, a soluble alkali metalsilicate, sodium carbonate, trisodium phosphate, carbon bisulphide, andan additive aldehyde compound functioning to reduce the alkalirequirement of the adhesive and increase the adaptiveneess of theadhesive to said alkali metal hydroxide, said adhesive having increasedspreading properties as compared to a similar adhesive without theadditive aldehyde compound. a

11. An adhesive composition comprising a reaction-product of a vegetableseed meal or flour as its adhesive base, an aqueous alkali medium, analkali earth metal hydroxide, a soluble metal silicate, sodiumcarbonate, trisodium phosphate, carbon bisulphide, and an aldehydebisulphite compound functioning to reduce the alkali requirement of theadhesive and increase the adaptiveness of the adhesive to said alkalimetal hydroxide, said adhesive having increased spreading properties ascompared to a similar adhesive VUl uumruol luuo,

COATING OR PLAST'C without the additive aldehyde bisulphite compound.

12. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalinemedium, and a proportion of an additive aldehyde compound equal to about/2% to 5% of seed meal or flour functioning to reduce the alkalirequirement of the adhesive, the latter having increased spreadingproperties as compared to an adhesive without the additive aldehydecompound.

13. An adhesive composition comprising the reaction-product of soya beanmeal or flour as its adhesive base, an aqueous alkaline medium, and aproportion of an additive aldehyde compound equal to about /2% to 5% ofseed meal or flour functioning to reduce the alkali requirement of theadhesive, the latter having increased spreading properties as comparedto an adhesive without the additive aldehyde compound.

14. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalinemedium, and a proportion of a formaldehyde bisulphite compound equal toabout /z% to 5% of said meal or flour, the formaldehyde bisulphitecompound functioning to reduce the alkali requirement of the adhesive,the latter having increased spreading properties as compared to anadhesive without the formaldehyde bisulphite compound.

' 15. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalinemedium, an alkali earth metal hydroxide, and a proportion of an additivealdehyde compound equal to about /2% to 5% of said meal or flourfunctioning to reduce the alkali requirement of the adhesive andincrease the adaptiveness of the adhesive to said alkali metalhydroxide, said adhesive having increased spreading properties ascompared to a similar adhesive without the additive aldehyde compound.

16; An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalinemedium, an alkali earth metal hydroxide, a soluble alkali metalsilicate, and aproportion of an additive aldehyde compound equal toabout 5% to 5% of said meal or flour functioning to reduce the alkalirequirement of the adhesive and increase the adaptiveness of theadhesive to said alkali metal hydroxide, said adhesive having increasedspreading properties as compared to a similar adhesive without theadditive aldehyde compound.

1'7. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalinemedium, an alkali earth metal hydroxide, a soluble alkali metalsilicate, an alkali carbonate, an alkali phosphate, and a proportion ofan additive aldehyde compound equal to about to 5% of said meal or flourfunctioning to reduce the alkali requirement of the adhesive andincrease the adaptiveness of the adhesive to said alkali metalhydroxide, said adhesive having increased spreading properties ascompared to a similar adhesive without the additive aldehyde compound.

18. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalinemedium, an alkaline earth metal hydroxide, a soluble alkali metalsilicate, sodium carbonate, trisodium phosphate, and a proportion of anadditive aldehyde compound equal to about to 5% of said meal or flourfunctioning to reduce the alkali requirement of the adhesive andincrease the adaptiveness of the adhesive to said alkali metalhydroxide, said adhesive having increased spreading properties ascompared to a similar adhesive without the additive aldehyde compound.

19. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalimedium, an alkali earth metal hydroxide, a soluble alkali metalsilicate, an alkali carbonate, an alkali phosphate, carbon bisulphide,and a proportion of an additive aldehyde compound equal to about to 5%of said meal or flour functioning to reduce the alkali requirement ofthe adhesive and increase the adaptiveness of the adhesive to saidalkali metal hydroxide, said adhesive having increased spreadingproperties as compared to a similar adhesive without the additivealdehyde compound.

20. An adhesive composition comprising the reaction-product of avegetable seed meal or flour as its adhesive base, an aqueous alkalimedium, an alkali earth metal hydroxide, a soluble alkali metalsilicate, sodium carbonate, trisodium phosphate, carbon bisulphide, anda proportion of an additive aldehyde compound equal to about /2% to 5%of said meal or flour functioning to reduce the alkali requirement ofthe adhesive and increase the adaptiveness of the adhesive to saidalkali metal hydroxide, said adhesive having increased spreadingproperties as compared to a similar adhesive without the additivealdehyde 1530 compound.

21. An adhesive composition comprising a reaction-product of a vegeiableseed meal or flour as its adhesive base, an aqueous alkali medium, analkali earth metal hydroxide, a soluble metal silicate, sodiumcarbonate, trisodium phosphate, carbon bisulphide, and a proportion ofan aldehyde bisulphite compound equal to about /2% to 5% of said meal orflour functioning to reduce the alkali requirement of the adhesive andincrease the adaptiveness of the adhesive to said alkali metalhydroxide, said adhesive having increased spreading properties ascompared to a similar adhesive without the additive aldehyde bisulphitecompound.

.GEORGE H. OSGOOD.

